Eckart Hoene received his M.S. degree in electrical engineering from Technical University (TU) Berlin, Germany, in 1997. He received his Ph.D. degree on the topic of EMC of Drive Systems from TU Berlin in 2001. He joined the Fraunhofer Institute for Reliability and Microintegration, Berlin, as a scientific assistant and worked toward his Ph.D. degree simultaneously. He continued at Fraunhofer as a postdoc, group leader, and business development manager.
In 2014, he became an adjunct professor at Aalborg University, Denmark, in addition to the courses he chairs for the European Center for Power Electronics and his Fraunhofer affiliation. The technical focus of his work is high switching frequencies in power electronics, packaging semiconductors, and electromagnetic compatibility. His group works mainly under contract with industry customers. He holds more than ten patents and is regularly invited to speak at conferences.
Title: Packaging, integration and fast switching: what has been achieved and what´s next?
Abstract: Faster semiconductors enable a big step towards size reduction and efficiency increase. With WBG packaging came into focus, as parasitic properties inhibit the instantaneous adaption of their superior properties. While packaging is a profession very much driven by material properties, reliability and manufacturing, now electromagnetic design has to be considered as well, by the package designers as well as development engineers. Only close interaction between both will bring power electronics to the next step.
This presentation will give an overview on achievements in packaging and its implementation into commercial products as well as new concepts intended to reduce the technological market barrier. Examples for power electronic equipment using new kinds of packages are demonstrated as well as open issues for further research pointed out.
On the application side design becomes more elaborate due to the requirement for electromagnetic design. Main issues to be considered are pointed out and proposals are made, how to enhance design tools to support the designer.
Garron Morris received his Bachelor and Master of Science degrees in mechanical engineering from University of Wisconsin-Milwaukee in 1994 and 1996, respectively.
From 1996 to 1998, Garron performed research on spray cooling of cellular base stations at Motorola’s Advanced Thermal Lab. After two years at GE Global Research, Garron joined GE Healthcare where he was promoted to principal engineer responsible for developing and implementing advanced thermal management and power electronics technologies in high-performance Magnetic Resonance Imaging (MRI) systems.
Since 2010, Garron has been working at Rockwell Automation in Milwaukee, Wisconsin in motor drives research and development. In his current role as Hardware and Reliability Systems Architect, Garron is responsible for strategic planning, roadmaps, and research on predictive maintenance, corrosion mitigation, and reliability of power electronics used in motor drives. Garron has 16 US patents and received IEEE best paper award at the 2018 Reliability and Maintainability Symposium.
Title: Environmental Trends and Challenges on Power Packaging
Abstract: This keynote covers the environmental trends and challenges in packaged industrial power electronics products. Increasing power densities, coupled with new environmental stresses stemming from changing customer locations, behaviors, and applications have created reliability challenges for newer generation products to maintain the same level of robustness as older-generation products. Real examples from over 25 years of product development and failure analyses will be included.
Cyril Buttay received the Engineer and Ph.D. degrees from the Institut National des Sciences Appliquées (INSA) Lyon, Lyon, France, in 2001 and 2004, respectively.
From 2005 to 2007, he was a Research Associate with the Electrical Machines and Drives Research Team, University of Sheffield, Sheffield, U.K., and the Power Electronics Machines and Control Group, University of Nottingham, Nottingham, U.K.
Since 2008, he has been a Scientist with the French Centre National de Recherche Scientifique (CNRS), where he was with the Ampére Laboratory, Lyon, on the topic of packaging for power electronics, with a special focus on high-temperature, high-voltage, or highdensity applications. In 2020 he was a Visiting Scholar with the Center for Power Electronics Systems (CPES), Virginia Tech, Blacksburg, VA, USA.
Title: Review on Intelligent Power Modules
Abstract: Intelligent power modules (IPMs) include power semiconductors, gate drive circuits and sensors in a single package. They offer obvious advantages in terms of size and system integration, but they also may be advantageous when considering reliability or efficiency, or for some specific applications (high voltage, high frequency…). They are also attractive for wide bandgap semiconductor devices, as they can integrate the dedicated gate drive circuits and fast protections these components require.
This presentation gives an overview of IPMs described in the scientific literature as well as of those available commercially. The many features which make a power module intelligent are investigated, with a special focus on the possible technologies for their implementation. Finally, the different packaging technologies which can be considered are reviewed.
This is the summary of a report on intelligent power modules which was commissioned by the European Centre for Power Electronics (ECPE) in 2020.
Nick Baker received the M.Eng. degree in electrical and electronic engineering from Loughborough University, Leicestershire, U.K., in 2011. He completed his PhD in 2016 at Aalborg University on Junction Temperature Measurements in Power Semiconductors. In 2015, he was awarded European Power Electronics Association Young Member Award. From 2017 to 2019 he was a Post-Doc at Aalborg University, and has been an Independent Researcher funded by the Danish Independent Research Fund since 2020. His research interests are temperature measurements in power modules, intelligent power modules and novel packaging materials.
Title: Liquid Metal in Power Electronics
This presentation will give an overview on the use of Liquid-Metals in Power Electronics. The presentation will focus on the use of Gallium and its advantages and drawbacks, whether used as a Thermal Interface Material or as an alternative interconnect material. The presentation will show a prototype liquid-Gallium based top-side interconnect on a 200A diode that achieved 10x the lifetime as Aluminium wire-bonds when subjected to a power cycling test.
Dr. Ty McNutt currently serves as Director of Business Development for the Fayetteville, Arkansas location of Wolfspeed, a Cree Company. He manages various technical projects, and works closely with customers and their applications teams to integrate advanced silicon carbide device and packaging technologies into next generation systems. He is an inventor on seven issued patents on silicon carbide materials, devices, packaging, and applications, as well as authored or co-authored over 70 publications on wide bandgap devices. Dr. McNutt has been working in the field of silicon carbide for over 18 years and received his Ph.D. in Electrical Engineering from the University of Arkansas in the field of silicon carbide semiconductor device physics.
Title: Advances in SiC Power Modules for EV Charging
Abstract: Wolfspeed power modules products have long offered state-of-the-art performance in the 100kW range. New package platforms and generational advances in Silicon Carbide (SiC) devices have led to new portfolio offerings from 10’s of kilowatts to 100’s of kilowatts in unprecedented power densities. Designing with these new platforms will be explored, including implementations with industry standard footprints and high-performance solutions. Specific topologies and approaches will be discussed for charger solutions using highly efficient and power dense SiC solutions.
Dr. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland, College Park and the Director of the ME Department’s Design and Systems Reliability Division. He has over 25 years of research experience in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and power applications. Dr. McCluskey has published three books and over 150 peer-reviewed technical articles with over 3000 citations. He is an associate editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, a member of the board of governors of the IEEE Electronic Packaging Society, a fellow and director of IMAPS and a member of ASME and AIAA.
Title: Heterogeneous Integration Roadmap
Abstract: Heterogeneous integration (HI) is not possible without a source of power for the multiple devices and components involved. While it is possible to supply this power externally to one or more devices, it is typically advantageous to integrate the conversion and distribution of this power into the HI system. This makes power delivery one of the most critical elements in an HI system and one clearly requiring its own section of the roadmap.
HI provides significant advantages for power electronics as it permits wide bandgap power devices, which surpass silicon in power handling capability, efficiency, and operating temperature, to be integrated with silicon control, logic, and memory devices and with lower operating temperature passive devices. Nevertheless, HI of power electronics comes with a raft of challenges for SiP designers, as the power electronics require space, generate heat, and can cause electrical noise in the circuits.
This roadmap for Power Electronics for Heterogeneous Integration addresses the timeline for the development of the power conversion and distribution techniques needed to supply clean, efficient power at a variety of voltages to the wide range of devices in an HI system without significantly increasing system size. The roadmap focuses on the first of these categories – reducing power converter size. This requires the development of wide bandgap semiconductor devices which can convert higher levels of power more efficiently, combined with packaging technologies (i.e., interconnection and thermal management) and passive devices that can reduce the size and increase the power density of the converter circuits. Developing smaller converters is important because utilizing distributed conversion where each component is near to its power supply is critical to minimize interconnection losses and signal noise.
Stéphane Azzopardi received both the M.Sc.Eng. degree from the Graduate School of Engineering INSA of Toulouse, France, as well as the M.S. degree from the University of Toulouse, France, in 1993, and the Ph.D. degree in electronics from the University of Bordeaux, France, in 1998.
For two years, he was a Post-doctorate with the Laboratory of Professor Kawamura, Yokohama National University, Japan. In 2003, he became an Associate Professor with the Graduate School of Engineering ENSEIRB-MATMECA in Bordeaux, France. In 2012, he received the HDR (qualification to drive research activities). He joined the Research and Technology Center of Safran Group in September 2015, where he currently manages the expert team on “Components, Power Modules, and Materials.” His research focuses on the robustness and reliability of power semiconductor devices for aeronautical applications.
Title: Is Power Electronics Ready for Future Aircraft?
Abstract: Climate deregulation is one of the main reasons to reduce CO2 and NOx emissions in transportation. As recommended by the Advisory Council for Aeronautics Research in Europe (ACARE), targets were planned for 2050. Due to the COVID-19 sanitary crisis, allowing to have a direct observation of the impact of transportation on CO2 emission, the green aviation concept investigations -More Electrical Aircraft (MEA) and More Electrical Propulsion (MEP)- have strongly been accelerated. Indeed, MEA may allow a gain to replace the mechanically driven engine accessories and pneumatic and hydraulic systems with electrically driven versions. Furthermore, MEP is one of the solutions investigated to contribute to the pollution reduction of fossil fuels-based propulsion. Additionally, MEP involves higher embedded electrical power. With a strong need to reduce the weight of electrical parts including cables, increasing the electrical power means increasing the voltage on-board. Then, many limitations are emerging: high voltage enhances partial discharges, arcing and space charges phenomena; being closer to the turbofans involves high temperature power electronics; a need of size, weight, volume reduction of highly reliable power converters …
Emerging wide band gap power semiconductor devices, -Silicon Carbide (SiC) and Gallium Nitride (GaN)- are key enablers to push forward the green aviation. However, these devices may not be mature enough and their robustness is far from the silicon one. What about the technologies of power modules, magnetics, capacitors, sensors, connectors…?
The purpose of this talk is to briefly present the various power electronics technologies and to point out how mature they are when facing aeronautics applications.
Mona Ghassemi received the M.Sc. and Ph.D. degrees (Hons.) in electrical engineering from the University of Tehran, Tehran, Iran, in 2007 and 2012, respectively. She spent two years (from 2013 to 2015) researching as a Postdoctoral Fellow with the High Voltage Laboratory, University of Quebec, QC, Canada. She was also a Postdoctoral Fellow with the Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT, USA, from 2015 to 2017. In 2017, she joined the ECE Department, Virginia Tech, Blacksburg, VA, USA, as an Assistant Professor.
Her research interests include electrical insulation materials and systems, high voltage/field technology, multiphysics modeling, electromagnetic transients in power systems, and power system analysis and modeling.
She is an At-Large Member of the Administrative Committee of the IEEE Dielectrics and Electrical Insulation Society for 2020 to 2023, a Corresponding Member of the IEEE Conference Publication Committee of the IEEE Power and Energy Society, an Active Member of several CIGRE working groups and IEEE Task Forces, and a member of the Education Committee of the IEEE DEIS and PES. She was a recipient of the 2020 National Science Foundation (NSF) CAREER Award and the 2020 Air Force Office of Scientific Research (AFOSR) Young Investigator Research Program (YIP) Award. She is a registered Professional Engineer in the Province of Ontario, Canada, and an Associate Editor of the IEEE Transactions on Industry Applications, IET High Voltage, and the International Journal of Electrical Engineering Education.
Title: Insulation Materials and Systems for Power Electronic Modules
Abstract: This presentation critically discusses recent research on electrical insulation materials and systems used in power electronics devices and focuses on electrical treeing in silicone gel, PD modeling, and mitigation methods. For mitigation methods, electric field grading techniques, such as 1) various geometrical techniques, and 2) applying nonlinear dielectrics are discussed. Alternatives for silicone gel, such as liquid dielectrics, are also highlighted. The drawbacks of reported research and technical gaps are identified. It is shown that the investigations carried out to date are in their infancy regarding the working conditions targeted for next-generation WBG power devices.
Nicolas Botter received the B.S. degree in physics from the University of Lorraine, France, in 2015 and the M.S. degree in electrical engineering from the University of Strasbourg, France, in 2018. He is currently working toward the Ph.D degree in electrical engineering at the University of Grenoble Alpes, Grenoble, France. His research interests include the development and implementation of power electronics components in harsh environment for aircraft engines with SAFRAN.
Title: Reduction of Thermal Interfaces with New Processes and Materials
Abstract: Due to the massive introduction of wide band-gap semiconductor devices in power electronic systems, the thermal management of power modules becomes a key issue because of the increasing power density. Different cooling techniques as microchannels, jet arrays or metal foams were proposed in the past to reduce the global thermal resistance between the semiconductor chips and the cooling fluid. However, when convection heat transfers are very efficient, the contribution of thermal conduction becomes prominent. To improve it, solutions must be proposed to reduce the number of materials and therefore the number of thermal interfaces. Thus, this presentation will first present a literature survey about this topic, then it will focus on a new concept of power module based on the deposition of sintered Ag layers directly on a ceramic substrate.