Technical Session Overviews

Systems & Circuits

Wednesday 1:00 Pm - 3:05 PM

Session Chair: Brian Narveson of PSMA

  • An Efficient Single Stage Boost Inverter with One Cycle Control for PV Applications
  • Commercializing Medium Voltage VFD Technology That Utilizes High Voltage SiC Technology
  • Design and Construction of a Co-Planar Power Bus Interconnect for Low Inductance Switching
  • Analysis of Flyback Quasi-Z Source PFC Rectifier and its Comparison with Traditional Flyback PFC
  • Toggle Rate Estimation and Glitch Analysis on Logic Circuits

Modules

Wednesday 3:30 PM - 5:35 PM

Session Chair: Ty McNutt of Wolfspeed

  • Advanced Double Sided Cooling IGBT Module and Power Control Unit Design
  • Performance Analysis of a SiC MOSFET Half Bridge Power Module with a Miller Clamp
  • Technique for Embedding Current Measurement and Ringing Suppression Within Multichip Modules
  • Characterization, Mission Profile Analysis and Calorimetric Loss Measurement of a SiC Hybrid Module for Main Inverter Application of Electric Vehicles
  • High Accuracy Examination on Identification of Partial Discharge Location in Power Module Using Multiple Loop Sensors

Poster Session

Wednesday 6:00 PM - 8:00 PM

Session Chair: Bram Ferreira of TU Delft

  • Epoxy/H-BN Composites Based on Oriented Boron Nitride Platelets with High Thermally Conductivity for Electronic Encapsulation
  • Lifetime Prediction of a Viscoplastic Lead-Free Solder
  • Investigation of Prototype SiC Power Module Structure for Low Inductance and High Heat Operation
  • Design and Fabrication of Sensor Chip with Heater for Semiconductor Flip-Chip Package Applicaton

Packaging & Interconnects

Thursday 1:00 PM - 3:05 PM

Session Chair: Lauren Kegley of Wolfspeed

  • A Review of SiC Power Module Packaging Technologies: Attaches, Interconnections, and Advanced Heat Transfer
  • A Study on Packaging Design of SiC Power Module Using Near-Field Magnetic Scanning Techniques
  • Thermo-Mechanical Reliability Analysis of Flip-Chip Bonded Silicon Carbide Schottky Diodes
  • Thermal Conductivity of Cu-Sn Transient Liquid Phase Sintered Interconnects for High Power Density Modules
  • Low Temperature Cu-Cu Bonding Using Cu-Ag Core-Shell nanosolders for 3D Packaging Applications

Thermal Management

Thursday 3:30 PM - 5:35 PM

Session Chair: Patrick McCluskey of the University of Maryland

  • Thermal Management for GaN Power Devices Mounted on PCB Substrates
  • Reducing Thermal Coupling Using Fluid Cooled Low-K Interposers
  • Thermal Improvement of Press-Pack Packages: Pressure Dependent Thermal Contact Resistance with a Silver Interlayer Between Molybdenum Substrate and SiC Chip
  • Stacked Power Module with Integrated Thermal Management
  • Direct Liquid Cooling of High Performance Silicon Caribide (SiC) Power Modules

Sensors, Passives, & EMI

Friday 11:20 AM - 1:00 PM

Session Chair: Thierry Liebey of the University of Toulouse

  • Suppression of Electromagnetic Interference Using Shielding and Screening Techniques Within Switching Cells
  • PCB Integrated Magnetic Component for Medium Power PFC Converter (3.3 Kw)
  • High Frequency High Voltage Generation with Planar Air-Core Transformer
  • Improved High-Temperature Dielectric Property of Epoxy Resin Composites with Nano- and Micro-Sized Magnesia Fillers