“Packaging, Integration and Fast Switching: What has been Achieved and What´s Next?”

Eckart Hoene, Chief Expert Power Electronics, Fraunhofer IZM, Germany

Abstract: Faster semiconductors enable a big step towards size reduction and efficiency increase. With WBG packaging came into focus, as parasitic properties inhibit the instantaneous adaption of their superior properties. While packaging is a profession very much driven by material properties, reliability and manufacturing, now electromagnetic design has to be considered as well, by the package designers as well as development engineers. Only close interaction between both will bring power electronics to the next step. This presentation will give an overview on achievements in packaging and its implementation into commercial products as well as new concepts intended to reduce the technological market barrier. Examples for power electronic equipment using new kinds of packages are demonstrated as well as open issues for further research pointed out. On the application side design becomes more elaborate due to the requirement for electromagnetic design. Main issues to be considered are pointed out and proposals are made, how to enhance design tools to support the designer.


“Paving the Way to Automotive GaN: The Importance of Packaging”

Tamara Baksht, CEO, VisIC Technologies, Israel

Abstract: Power packaging has a critical impact on power switches’ performance in traction inverter, since it controls power dissipation and thus dictates maximal junction temperature and maximum current of power switches. In wide band gap semiconductor (WBG) based products for inverter traction, such as SiC and especially GaN, drain and gate inductances limit maximal operation voltage due to voltage spike caused by high current  switched in an extremely short time, sometimes as short as
10 – 20 ns for 300A – 500A. Therefore, careful alignment of semiconductor design and power package design is required to realize the performance level expected from WBG semiconductors.

In this work, we present an 800A module based on D3GaN (Direct Drive D-mode) technology, with a maximal rating of 650V and extremely low switching energy and voltage overshoot.


“Environmental Trends and Challenges on Power Packaging”

Chris Genthe, Senior Principal Engineer, Rockwell Automation, USA

Abstract: This keynote covers the environmental trends and challenges in packaged industrial power electronics products.  Increasing power densities, coupled with new environmental stresses stemming from changing customer locations, behaviors, and applications have created reliability challenges for newer generation products to maintain the same level of robustness as older-generation products.  Real examples from over 25 years of product development and failure analyses will be included.


“Insulation Materials and Systems for Power Electronic Modules: Challenges and Future Research Needs”

Mona Ghassemi, Associate Professor, UT Dallas, USA

Abstract: This presentation critically discusses recent research on electrical insulation materials and systems used in power electronics devices and focuses on electrical treeing in silicone gel, PD modeling, and mitigation methods. For mitigation methods, electric field grading techniques, such as 1) various geometrical techniques, and 2) applying nonlinear dielectrics are discussed. Alternatives for silicone gel, such as liquid dielectrics, are also highlighted. The drawbacks of reported research and technical gaps are identified. It is shown that the investigations carried out to date are in their infancy regarding the working conditions targeted for next-generation WBG power devices.


“Modeling and Simulation of Conducted EMI in Power Electronic Systems”

Aaron Brovont, Senior Lead Engineer, PC Krause Associates, USA

Aaron Brovont

Abstract: The growing adoption of wide-bandgap technologies and applications promises to make electromagnetic compatibility an ever more critical element of power electronics design. This talk provides an overview of the latest modeling and simulation techniques employed for conducted emissions in power electronics systems. Emphasis is placed on understanding common-mode behavior and mode conversion resulting from system asymmetry through the use of equivalent circuits. The application of equivalent circuits to analyze and mitigate conducted emissions resulting from typical power module parasitics is demonstrated. Opportunities for modeling and simulation in the context of the electromagnetic compatibility challenges presented by current trends in power electronics are discussed.


“Reliability Trends in Power Electronics”

Francesco Iannuzzo, Professor, Aalborg University, Denmark

Abstract: Due to the recent trend toward the adoption of renewables and electric vehicles, power electronics is booming as it is the key enabling technology for both of them. However, due to the intrinsic complexity of power components, their reliability is not comparable to mechanical parts and ends up limiting the overall system reliability. Reliability of power electronics is now an established discipline coping with these issues and studying failure mechanisms and methods to limit or prevent them to occur. Expectations from the industry are very demanding, both in terms of prolonged life and in intelligent design, aimed, e.g., at a smarter control for load throttling, condition monitoring for enabling timely interventions, and data logging for an improved insight of damage processes. Prospects are rich in challenges as well as opportunities, especially from the new-technologies point of view, such as artificial intelligence.