IWIPP 2027 Paper Submission

 Submission

 Important Dates

• October 9, 2026: Two-page abstract submission deadline.
• November 26, 2026: Notification of acceptance.
• January 18, 2027, Final manuscript (4-page) submission and copyright deadline.

 Template of Two-page Abstract

Template is here.

Note for Submission

Two-page original abstract submission should clearly state what is NEW in your paper and how the work advances prior art. Use document template available at above link. Full manuscripts of accepted papers will be due before the conference. Registration for the conference is required for the author to present the paper.

 Main Categories of Interest (not limited)

 Device and Application  

• Power Semiconductor Devices
• Die attach and wire bonding
• Packaging Materials
• High Temperature & High Voltage Dielectrics
• Interconnection technologies
• Printed Circuit Boards (PCB)
• High-Frequency Magnetics
• Thermal Interface Materials
• Electromagnetic Interference

 Integration and Design 

• Design for Manufacturability, Compatibility with Standards Innovative packaging strategies
• High-Temperature Capacitors
• System Integration and Optimization
• Compact Converter Design Techniques
• Gate/Base Drivers, Sensors & Protection

 Reliability and Test     

• Components to System Reliability
• Reliability Assessment & Lifetime Prediction
• Partial Discharge
• Thermal Management
• Power Cycling
• Environmental test
• Failure analysis