- Materials, Semiconductors and Components
- Power Semiconductor Devices
- Packaging Materials
- High Temperature & High Voltage Dielectrics
- High-Temperature Capacitors
- Printed Circuit Boards (PCB)
- High-Frequency Magnetics
- Thermal Interface Materials
- Packaging, manufacturing, and semiconductor integration
- Design for Manufacturability, Compatibility with Standards
- Die attach and wire bonding
- Innovative packaging strategies
- Interconnection technologies
- Reliability, Thermal and Electrical Management
- Components to System Reliability
- Reliability Assessment & Lifetime Prediction
- Partial Discharge
- Thermal Management
- Power Cycling
- Converter and system integration
- Electromagnetic Interference
- System Integration and Optimization
- Compact Converter Design Techniques
- Gate/Base Drivers, Sensors & Protection